Through-Hole vs. Surface Mount

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 In recent years, semiconductor packaging has evolved with an increased demand for greater functionality, smaller size, and added utility. A modern PCBA design has two main methods for mounting components onto a PCB: Through-Hole Mounting and Surface Mounting.  

Through-hole

Through-Hole Mounting (THM):

Through-hole mounting is the process by which component leads are placed into drilled holes on a bare PCB. The process was standard practice until the rise of surface mount technology (SMT) in the 1980s, at which time it was expected to completely phase out through-hole. Yet, despite a severe drop in popularity over the years, through-hole technology has proven resilient in the age of SMT, offering a number of advantages and niche applications: namely, reliability.  

Through-hole components are best used for high-reliability products that require stronger connections between layers. Whereas SMT components are secured only by solder on the surface of the board, through-hole component leads run through the board, allowing the components to withstand more environmental stress. This is why through-hole technology is commonly used in military and aerospace products that may experience extreme accelerations, collisions, or high temperatures. Through-hole technology is also useful in test and prototyping applications that sometimes require manual adjustments and replacements.

Overall, through-hole’s complete disappearance from PCB assembly is a wide misconception. Barring the above uses for through-hole technology, one should always keep in mind the factors of availability and cost. Not all components are available as SMD packages, and some through-hole components are less expensive.

However, that doesn’t negate that fact that, in a modern assembly facility, through-hole is considered a secondary operation.

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